Products
Top Tape TC307E8
Application
It´s suitable for use in the assembly of the small sizes
(below 0402) chip resistor, capacitor, and the inductor
(MLCC, Chip-R, inductor). After the moderate thermo-compression,
it can be sealed under the Top Part of Paper Carrier to bind and bear the weight of the chips. This not only displays stable peeling force
under SMT auto-injection processes, but is also safe and reliable.
Quality characteristics:
Material | Thickness | Tensile Strength | Elongation |
PET Film | 55±5 μm | 2.6±0.5 Kgf/5.25mm | 110±20 |
Scroll the table to the left ⟶
P.S. If you want to obtain product specifications, please contact us through “Contact Us”.