Warm-Off Thermal Release Dicing Tape DT023
1.For use in electronic components LCD Glass Plate、LED、MLCC 、
Diode、Inductor、Semi-Conductor manufacturing processes, It performs the properties of Fixing and Dicing at room temperature,when temperature is raised above 130℃ it will lose adhesion and easy to release the dicing finished components.
2.For all kinds of temporary fixing and releasing processes.
|Material||Thickness||Roll Type Length||Released at
|PET Film||0.15±0.02 mm||50 ; 100 M||30-100 g/25mm|