Cool-Off Thermal Release Dicing Tape DT001
The “Cool-Off＂ Thermal Release Dicing Tape DT001 is used
in dicing processes of electronic components manufacturing.
It provides adhesion to fix components (Ex: LCD glass plate、LED、MLCC、Diode、Inductor、Semi-Conductor Chips) when it heated up to above 55℃; while it will loss the adhesion when the temperature back to the room temperature. It is easily to release the dicing finished components without adhesive residues, pollution and can be reused repeatedly.
|Material||Thickness||Roll Type Length||Released at
|PET Film||0.15±0.03 mm||50 ; 100 M||0 g/25mm|