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Cool-Off Thermal Release Dicing Tape DT021

Application

1.For use in electronic components LCD Glass Plate、LED、MLCC 、
Diode、Inductor、Semi-Conductor manufacturing processes, It performs the properties of Fixing and Dicing at room temperature,when temperature is raised above 130℃ it will lose adhesion and easy to release the dicing finished components.
2.For all kinds of temporary fixing and releasing processes.

Quality characteristics:

MaterialThickness Roll Type LengthReleased at
room temperature
PET Film0.15±0.02 mm50 ; 100 M30-100 g/25mm
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P.S. If you want to obtain product specifications, please contact us through “Contact Us”.
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