It´s suitable for use in the assembly of the small sizes
(below 0603) chip resistor, capacitor, and the inductor
(MLCC, Chip-R, inductor). After the moderate thermo-compression,
it can be sealed under the Top Part of Paper Carrier to bind and bear the weight of the chips. This not only displays stable peeling force
under SMT auto-injection processes, but is also safe and reliable.